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Semiconductor Packaging Solutions
ASTI’s Semiconductor Packaging Solutions, marketed under the “EoPlex” brand, offers the design and development of backend semiconductor packaging solutions that are best suited for mobility and 3C convergence markets.

EoPlex’s award-winning xLC™ product addresses a multi-billion dollar leadframe market, and leadframes are used in billions of semiconductor chip packages. The xLC™ product provides lower cost, higher lead-count, smaller form factor packages with increased flexibility in multi-row, complex routed designs and System-in-Packages (SIPs) while reducing capacitive and inductive parasitics. Semiconductor chips packaged with xLC™ are designed for applications that include mobile phones, MP3 players, digital cameras, laptops, tablets, e-readers, data loggers, GPS units, and many other types of mobility products.

For more information on Semiconductor Packaging Solutions, please visit EoPlex at www.eoplex.com.

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33 Ubi Ave 3 #08-69 Vertex Singapore 408868  T (65) 6512 8310  Company Registration No.: 199901514C
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