Home Enquiries Career Opportunities Sitemap  
BEST Group
Semiconductor Equipment
Semiconductor Manufacturing Services
Semiconductor Packaging Solutions
Equipment Contract Manufacturing Services (ECMS)
Services Group
Our Business Network
Core Competencies
BEST Group
(Backend Equipment Solutions & Technologies)
Semiconductor Packaging Solutions
 
ASTI’s Semiconductor Packaging Solutions, marketed under the “EoPlex” brand, offers the design and development of backend semiconductor packaging solutions that are best suited for mobility and 3C convergence markets.

EoPlex’s award-winning xLC™ product addresses a multi-billion dollar leadframe market, and leadframes are used in billions of semiconductor chip packages. The xLC™ product provides lower cost, higher lead-count, smaller form factor packages with increased flexibility in multi-row, complex routed designs and System-in-Packages (SIPs) while reducing capacitive and inductive parasitics. Semiconductor chips packaged with xLC™ are designed for applications that include mobile phones, MP3 players, digital cameras, laptops, tablets, e-readers, data loggers, GPS units, and many other types of mobility products.

For more information on Semiconductor Packaging Solutions, please visit EoPlex at www.eoplex.com.

Our Affiliates:
Back to top
     
Blk 25 Kallang Avenue #06-01 Kallang Basin Industrial Estate Singapore 339416T (65) 6392 6922F (65) 6392 5522Company Registration No.: 199901514C
 
Copyright © 2019 ASTI Holdings Limited. All rights reserved. Terms & Conditions of Use.