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EoPlex’s award-winning xLC™ product addresses a multi-billion dollar leadframe market, and leadframes are used in billions of semiconductor chip packages. The xLC™ product provides lower cost, higher lead-count, smaller form factor packages with increased flexibility in multi-row, complex routed designs and System-in-Packages (SIPs) while reducing capacitive and inductive parasitics. Semiconductor chips packaged with xLC™ are designed for applications that include mobile phones, MP3 players, digital cameras, laptops, tablets, e-readers, data loggers, GPS units, and many other types of mobility products.
For more information on Semiconductor Packaging Solutions, please visit EoPlex at www.eoplex.com. |
